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H2

特性/ Features

1.高Tg:≥170℃ (DSC),无卤素  

High Tg:≥170℃ (DSC), Halogen free

2.低介电常数(Dk≤4.3, 10GHz) 

Low Dk≤4.3

3.低介质损耗(Df≤0.012 10GHz)  

Low Df≤0.014, 10GHz

4.优异的热性能,Td≥340℃ 

Excellent Thermal Resistance, Td≥340℃

5.低Z轴热膨胀系数 

Low Z axis CTE

6.较低的吸水性,耐CAF性能好,高可靠性 

Low water absorption, excellent anti-CAF, high reliability

7.无铅制程兼容 

Compatible with Lead-free process


应用领域/ Applications 

手机、电脑、背板、卡板、交换机、服务器、厚铜产品、汽车电子    

Mobile phone, Computer, Backplanes, card board, Switch, Servers, Heavy copper product, Automobile electronics.


建议压制程式/ Suggest Press cycle

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主要特性 / General properties

检测项目

Item

单位

Unit

检测条件

Test Condition

规范值

Spec

典型值

Typical Value

玻璃化转变温度Tg

DSC

≥170

175

剥离强度 Peel   Strength 1oz

N/mm

288℃, 10S

≥0.7

1.05

热应力Thermal   stress

S

288℃, solder dip

>10

180 s No delamination                 

弯曲强度                               Flexural   Strength

N/mm2

经向 Warp

≥415

550

纬向Fill

≥345

450

燃烧性Flammability

E 24/125

UL94V-0

V-0

表面电阻Surface   Resistivity

After moisture

≥1.0×104

3.54×108

体积电阻Volume   Resistivity

MΩ· cm

After moisture

≥1.0×106

4.70×1010

介电常数Dielectric   Constant

10GHZ  C 24/23/50

\

4.3

介质损耗角正切Loss   Tangent

10GHZ  C 24/23/50

\

0.012

耐电弧Arc Resistance

S

D 48/50+D 0.5/23

≥60

130

击穿电压Dielectric   Breakdown

KV

D 48/50+D 0.5/23

≥40

60

吸水率Moisture   Absorption

%

D 24/23

≤0.8

0.12

热分解温度Td

Weight Loss 5%

≥340

371

CTE                                       Z-axis

Alpha 1

ppm / ℃

TMA

≤60

42

Alpha 2

ppm / ℃

≤300

240

50 - 260 ℃

%

≤3.0

2.45

T288(Unclad)

Min

TMA

≥15

>60

Specimen thickness: 1.0mm    

Specification sheet:IPC-4101E/130, is for your reference only 

Explanation: C: Humidity conditioning   D: Immersion conditioning distilled water  E: Temperature conditioning

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